IQIs for Radioscopy
Image Quality Indicators (IQIs), or penetrameters of different designs have been developed by the various standard setting organizations. JEM produces two principal types of IQI's,
HOLE-TYPE or plaque IQI's, and
WIRE-TYPE IQI's, listed below according to type and related reference standard. JEM also produces specialty IQI's for
Aerospace and
Electronic inspection applications, as listed below.
Hole type IQI's are very similar in overall dimensions and in the position and diameter of a series of three holes through the IQI. Hole-Type IQI's are Selected by specific material and designation (size), the following pages are intended to facilitate the selection of appropriate size IQI for a given inspection operation and to show the dimensional equivalence (interchangeability) of IQI's of different standards.
HOLE-TYPE IQIs
| ASTM E 1025-94, Standard Practice for Design, Manufacture, and Material Grouping Classification of Hole-Type Image Quality Indicators (IQI) Used for Radiology |
| ASTM E 1742, formerly MIL-STD-453C, Military Standard Test Inspection, Radiographic |
- ASME BOILER AND PRESSURE VESSEL CODE (SECTION 5, Nondestructive Examination, ARTICLE 22-Radiographic Standards), 1995
- MIL - STD - 271F (SH), Military Standard, Requirements for Nondestructive Testing Methods
- NAVSEA 250-1500-1 Military Standard, Requirements for Nondestructive Testing Methods
- API 1104, Standard for Welding Pipelines and Related Facilities, 18th Edition, 1995
Aerospace IQIs
- AMS 2635C (1981), Radiographic Inspection
- PRATT & WHITNEY TAMS
Wire IQIs
- ASTM E 747 - 97, Standard Practice for Design, Manufacture and Material Grouping Classification of Wire Image Quality Indicators (IQI) Used for Radiology
- DIN EN 462-1: 1994, Non-destructive testing, Image Quality of radiographs, Image quality indicators (wire type) and determination of image quality value
Electronic IQIs
- ASTM E 801 - 91, Standard Practice for Controlling Quality of Radiological Examination of Electronic Devices
- MIL - STD - 883C, Test Methods and Procedures for Microelectronics